Advanced Modular Power System Electronics Enclosure Thermal Testing

Colozza, Anthony J.; Gardner, Brent G.

An analysis was set up to model the temperature of the advanced modular power system (AMPS) power distribution cards when installed within the electronics enclosure case. The analysis was used to determine the steady-state temperature distribution of the cards within the case. To verify the analysis, an experiment was set up and conducted to simulate the operation of the cards within the enclosure. Four tests were conducted. The tests varied the position of the cold plate and evaluated the use of a thermal compound to reduce the contact resistance between the joints within the thermal path between the cards and the cold plate. Three of the four cases examined showed very good agreement between the analysis and the experiment with a less than 1-percent variation in the predicated temperatures determined through the analysis and the experimentally derived temperatures. In the remaining case, the difference between the analysis and experiment was approximately 12 percent. Both the experiment and analysis showed that the modular power conditioning cards can be maintained within their desired maximum operating temperature range of 40 to 45 °C through thermal conduction to a cold plate when operating with their estimated maximum heat output of 16 W per card.

Document ID

20190025222

Acquisition Source

Glenn Research Center

Document Type

Technical Memorandum (TM)

Authors

Date Acquired

May 20, 2019

Publication Date

May 1, 2019

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Public

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20190025222.pdf

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